3D00800 - SEMI 3D8 - Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process StdVol-Process Chemicals This Standard also provides guidelines

This Standard also provides guidelines for grades of ammonium fluoride 40% for which a need has been identified

SEMI C47-0699 (first published - replaces SEMI C7

SEMI M12 — Specification for Serial Alphanumeric Marking of the Front Surface of Wafers

and delivery conditions should be taken into account when planning the testing

diatomic gas comprising approximately 78% of the earth’s atmosphere

3D00800 - SEMI 3D8 - Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process StdVol-Process Chemicals This Standard also provides guidelinesThis Guide is intended to address the needs of the 3D Stacked IC (3DS IC) industry by defining the items parameters needed to procure virgin silicon carrier wafers to be used in a 3DS IC process. This Guide defines the items parameters to acquire silicon wafers to be used as carrier wafers in a temporary bond debond (TBDB) application. This Guide describes silicon wafers with nominal diameter of 300 mm although, for 3DS IC applications, the actual